Semiconductor device and method for fabricating the same

ABSTRACT

A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a single diffusion break (SDB) structure in the substrate to divide the fin-shaped structure into a first portion and a second portion; forming a first gate structure on the SDB structure; forming an interlayer dielectric (ILD) layer around the first gate structure; transforming the first gate structure into a first metal gate; removing the first metal gate to form a first recess; and forming a dielectric layer in the first recess.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 17/338,666,filed on Jun. 4, 2021, which is a division of U.S. application Ser. No.16/807,108, filed on Mar. 2, 2020, which is a continuation-in-part ofU.S. application Ser. No. 15/873,838, filed on Jan. 17, 2018. Thecontents of these applications are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The invention relates to a method for fabricating semiconductor device,and more particularly to a method for dividing fin-shaped structure toform single diffusion break (SDB) structure.

2. Description of the Prior Art

With the trend in the industry being towards scaling down the size ofthe metal oxide semiconductor transistors (MOS), three- dimensional ornon-planar transistor technology, such as fin field effect transistortechnology (FinFET) has been developed to replace planar MOStransistors. Since the three-dimensional structure of a FinFET increasesthe overlapping area between the gate and the fin-shaped structure ofthe silicon substrate, the channel region can therefore be moreeffectively controlled. This way, the drain-induced barrier lowering(DIBL) effect and the short channel effect are reduced. The channelregion is also longer for an equivalent gate length, thus the currentbetween the source and the drain is increased. In addition, thethreshold voltage of the fin FET can be controlled by adjusting the workfunction of the gate.

In current FinFET fabrication, after shallow trench isolation (STI) isformed around the fin-shaped structure part of the fin-shaped structureand part of the STI could be removed to form a trench, and insulatingmaterial is deposited into the trench to form single diffusion break(SDB) structure or isolation structure. However, the integration of theSDB structure and metal gate fabrication still remains numerousproblems. Hence how to improve the current FinFET fabrication andstructure has become an important task in this field.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention, a method forfabricating semiconductor device includes the steps of: providing asubstrate having a fin-shaped structure thereon; forming a singlediffusion break (SDB) structure in the substrate to divide thefin-shaped structure into a first portion and a second portion; forminga first gate structure on the SDB structure; forming an interlayerdielectric (ILD) layer around the first gate structure; transforming thefirst gate structure into a first metal gate; removing the first metalgate to form a first recess; and forming a dielectric layer in the firstrecess.

According to another aspect of the present invention, a semiconductordevice includes a single diffusion break (SDB) structure dividing afin-shaped structure into a first portion and a second portion and anisolation structure on the SDB structure. Preferably, the isolationstructure comprises a T-shape or more specifically T-shapecross-section.

According to yet another aspect of the present invention, asemiconductor device includes a single diffusion break (SDB) structuredividing a fin-shaped structure into a first portion and a secondportion, an isolation structure on the SDB structure, and a first spaceradjacent to the isolation structure. Preferably, a top surface of thefirst spacer is lower than a top surface of the isolation structure.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-6 illustrate a method for fabricating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 7-10 illustrate a method for fabricating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 11-16 illustrate a method for fabricating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 17-20 illustrate a method for fabricating a semiconductor deviceaccording to an embodiment of the present invention.

DETAILED DESCRIPTION

Referring to FIGS. 1-6 , FIGS. 1-6 illustrate a method for fabricating asemiconductor device according to an embodiment of the presentinvention, in which FIG. 1 is a top view illustrating a method forfabricating the semiconductor device, left portions of FIGS. 2-6illustrate cross-sectional views of FIG. 1 for fabricating thesemiconductor device along the sectional line AA′, and right portions ofFIGS. 2-6 illustrate cross-sectional views of FIG. 1 for fabricating thesemiconductor device along the sectional line BB′. As shown in FIGS. 1-2, a substrate 12, such as a silicon substrate or silicon-on-insulator(SOI) substrate is first provided, and a plurality of fin-shapedstructures 14 are formed on the substrate 12. It should be noted thateven though nine fin-shaped structures 14 are disposed on the substrate12 in this embodiment, it would also be desirable to adjust the numberof fin-shaped structures 14 depending on the demand of the product,which is also within the scope of the present invention.

Preferably, the fin-shaped structures 14 of this embodiment could beobtained by a sidewall image transfer (SIT) process. For instance, alayout pattern is first input into a computer system and is modifiedthrough suitable calculation. The modified layout is then defined in amask and further transferred to a layer of sacrificial layer on asubstrate through a photolithographic and an etching process. In thisway, several sacrificial layers distributed with a same spacing and of asame width are formed on a substrate. Each of the sacrificial layers maybe stripe-shaped. Subsequently, a deposition process and an etchingprocess are carried out such that spacers are formed on the sidewalls ofthe patterned sacrificial layers. In a next step, sacrificial layers canbe removed completely by performing an etching process. Through theetching process, the pattern defined by the spacers can be transferredinto the substrate underneath, and through additional fin cut processes,desirable pattern structures, such as stripe patterned fin-shapedstructures could be obtained.

Alternatively, the fin-shaped structures 14 could also be obtained byfirst forming a patterned mask (not shown) on the substrate, 12, andthrough an etching process, the pattern of the patterned mask istransferred to the substrate 12 to form the fin-shaped structures 14.Moreover, the formation of the fin-shaped structures 14 could also beaccomplished by first forming a patterned hard mask (not shown) on thesubstrate 12, and a semiconductor layer composed of silicon germanium isgrown from the substrate 12 through exposed patterned hard mask viaselective epitaxial growth process to form the corresponding fin-shapedstructures 14. These approaches for forming fin-shaped structure are allwithin the scope of the present invention.

Next, a shallow trench isolation (STI) 16 is formed around thefin-shaped structures 14. In this embodiment, the formation of the STI16 could be accomplished by conducting a flowable chemical vapordeposition (FCVD) process to form a silicon oxide layer on the substrate12 and covering the fin-shaped structures 14 entirely. Next, a chemicalmechanical polishing (CMP) process along with an etching process areconducted to remove part of the silicon oxide layer so that the topsurface of the remaining silicon oxide is slightly lower than the topsurface of the fin-shaped structures 14 for forming the STI 16.

After the STI structure 16 is formed, a single diffusion break (SDB)structure 18 is formed in the substrate 12 to divide each of thefin-shaped structures 14 into a first portion 20 and a second portion22. Preferably, the formation of the SDB structure 18 could beaccomplished by conducting a photo-etching process to remove part of thefin-shaped structures 14 for forming a recess, forming a dielectriclayer into the recess, and then conducting a planarizing process such asCMP with optional etching back process to remove part of the dielectriclayer so that the top surface of the remaining dielectric layer isslightly lower than the top surface of the divided fin-shaped structures14. As shown in FIG. 1 , the fin-shaped structures 14 are disposedextending along a first direction (such as X-direction) and the SDBstructure 18 is disposed extending along a second direction (such asY-direction), in which the SDB structure 18 preferably separates each ofthe fin-shaped structures 14 into two portions, including a firstportion 20 on the left side of the SDB structure 18 and a second portion22 on the right side of the SDB structure 18.

It should be noted that even though the SDB structure 18 is formed afterthe STI 16 in this embodiment, the SDB structure 18 could also be formedat the same time with the STI 16, which is also within the scope of thepresent invention. If the STI 16 and the SDB structure 18 were formed atthe same time, the two elements would preferably be made of dielectricmaterial including but not limited to for example silicon oxide.Nevertheless, if the SDB structure 18 were formed after the STI 16, theSTI 16 would preferably be made of silicon oxide while the SDB structure18 could be made of either silicon oxide or silicon nitride. In otherwords, the STI 16 and the SDB structure 18 could be selected from thegroup consisting of silicon oxide and silicon nitride while the STI 16and the SDB structure 18 could be made of same material or differentmaterial depending on the demand of the process, which are all withinthe scope of the present invention.

Next, gates structures 24, 26, 28, 30, 32, 34, 36, 38, 40 or dummy gatesare formed on the fin-shaped structure 14 and the STI 16, in which theleft portion of FIG. 2 illustrates gate structures 30, 34 disposed onthe fin-shaped structure 14 and gate structure 32 disposed directly ontop of the SDB structure 18 while the right portion of FIG. 2illustrates a gate structure 36 adjacent to an edge of the fin-shapedstructure 14 and a portion of the gate structure 38 standing directly ontop of the STI 16. In this embodiment, the formation of the gatestructures 24, 26, 28, 30, 32, 34, 36, 38, 40 could be accomplished by agate first process, a high-k first approach from gate last process, or ahigh-k last approach from gate last process. Since this embodimentpertains to a high-k last approach, a gate dielectric layer orinterfacial layer, a gate material layer made of polysilicon, and atleast a selective hard mask could be formed sequentially on thesubstrate 12, and a photo-etching process is then conducted by using apatterned resist (not shown) as mask to remove part of the hard mask,part of the gate material layer, and part of the gate dielectric layerthrough single or multiple etching processes. After stripping thepatterned resist, gate structures 24, 26, 28, 30, 32, 34, 36, 38, 40each composed of a patterned gate dielectric layer 42, a patternedmaterial layer 44, a hard mask 45, and a hard mask 46 are formed on thefin-shaped structure 14, the SDB structure 18, and the STI 16.Specifically, a dual hard mask structure composed of a hard mask 45 andanother hard mask 46 is disposed on top of the patterned material layer44 in this embodiment, in which the hard mask 45 is preferably made ofsilicon oxide and the hard mask 46 is made of silicon nitride.Nevertheless, according to an embodiment of the present invention, thehard masks 45 and 46 could also be made of different material while thetwo hard masks 45, 46 could be selected from the group consisting ofsilicon oxide and silicon nitride, which are all within the scope of thepresent invention.

Next, at least a spacer 48 is formed on the sidewalls of the each of thegate structures 24, 26, 28, 30, 32, 34, 36, 38, 40, a source/drainregion 50 and/or epitaxial layer (not shown) is formed in the fin-shapedstructure 14 adjacent to two sides of the spacer 48, and selectivesilicide layers (not shown) could be formed on the surface of thesource/drain regions 50. In this embodiment, the spacer 48 could be asingle spacer or a composite spacer, such as a spacer including but notlimited to for example an offset spacer and a main spacer. Preferably,the offset spacer and the main spacer could include same material ordifferent material while both the offset spacer and the main spacercould be made of material including but not limited to for example SiO₂,SiN, SiON, SiCN, or combination thereof. The source/drain regions 50could include n-type dopants or p-type dopants depending on the type ofdevice being fabricated. Next, a selective contact etch stop layer(CESL) (not shown) is formed on the gate structures 24, 26, 28, 30, 32,34, 36, 38, 40 and the STI 16, and an interlayer dielectric (ILD) layer54 is formed on the CESL.

Next, as shown in FIG. 3 , a planarizing process such as CMP isconducted to remove part of the ILD layer 54, the hard masks 46, andpart of the spacers 48 so that the top surfaces of the hard masks 45 andthe remaining ILD layer 54 are coplanar. Next, a patterned mask 56 isformed on the ILD layer 54, in which the patterned mask 56 includesopenings 58, 60 to expose the top surface of the gate structures 32 and38. In this embodiment, the patterned mask 56 could be a tri-layeredstructure including an organic dielectric layer (ODL), asilicon-containing hard mask bottom anti-reflective coating (SHB), and apatterned resist and the step of forming the openings 58, 60 in thepatterned mask 56 could be accomplished by using the patterned resist asmask to remove part of the SHB and part of the ODL.

Next, an etching process is conducted by using the patterned mask 56 asmask to remove the hard masks 45 and the patterned material layers 44 ofthe gate structures 32, 38 for forming a first recess 62 exposing theSDB structure 18 and a second recess 64 exposing the STI 16. As shown inFIGS. 2-3 , it should be noted that the first recess 62 formed at thisstage is extending along the same direction (such as Y-direction) as theSDB structure 18 underneath while the second recess 64 is formedextending along a different X-direction to divide gate structures 24,26, 28, 30 and gate structures 34, 36, 38, 40 into smaller segments.

It should further be noted that the depths of the first recess 62 andthe second recess 64 could be the same or different depending on thedemand of the SDB structure 18 and STI 16 underneath. For instance, ifthe SDB structure 18 were made of silicon nitride while the STI 16 weremade of silicon oxide, the bottom surface of the first recess 62 formedafterwards could be slightly lower or higher than the bottom surface ofthe second recess 64 depending on the etchant used during the etchingprocess and if both the SDB structure 18 and STI 16 were made of samematerial such as silicon oxide, the bottom surfaces of the two recesses62, 64 would preferably be coplanar.

Next, as shown in FIG. 4 , a dielectric layer 66 is formed in the firstrecess 62 and the second recess 64 at the same time to fill the firstrecess 62 and second recess 64 completely. In this embodiment, thedielectric layer 66 could be made of dielectric material including butnot limited to for example silicon dioxide (SiO₂), silicon oxycarbide(SiOC), silicon nitride, or combination thereof.

Next, as shown in FIG. 5 , a planarizing process such as CMP isconducted to remove part of the dielectric layer 66, the hard masks 45,and even part of the ILD layer 54 and part of the CESL to form anotherSDB structure 68 between the gate structures 30, 34 and an isolationstructure 70 on top of the STI 16 and adjacent to the gate structure 36,in which the top surfaces of the SDB structure 68, the isolationstructure 70, and the ILD layer 54 are coplanar.

Preferably, the new SDB structure 68 includes a bottom portion 72embedded within the fin-shaped structure 14 and a top portion 74 on thebottom portion 72. Preferably, the top portion 74 of the SDB structure68, the bottom portion 72 of the SDB structure 68, the isolationstructure 70, and the STI 16 could be selected from the group consistingof SiO₂, SiOC, and SiN while the top portion 74 and the bottom portion72 could be made of same material or different material, the STI 16 andthe isolation structure 70 could be made of same material or differentmaterial, or the STI 16 and the bottom portion 72 of the SDB structure68 could be made of same material or different material.

For instance, the bottom portion 72 of the SDB structure 68 could bemade of silicon nitride while the top portion 74 is made of silicondioxide, the bottom portion 72 could be made of silicon dioxide whilethe top portion 74 is made of silicon nitride or SiOC, both the bottomportion 72 and the top portion 74 could be made of either silicondioxide or silicon nitride, the STI 16 could be made of silicon dioxidewhile the isolation structure 70 is made of silicon nitride, the STI 16could be made of silicon dioxide while the isolation structure 70 ismade of SiOC, the STI 16 could be made of silicon dioxide while thebottom portion 72 is made of silicon nitride and the top portion 74 andthe isolation structure 70 are made of SiOC, or the STI 16 and thebottom portion 72 could be made of silicon dioxide while the top portion74 and the isolation structure 70 are made of silicon nitride or SiOC,which are all within the scope of the present invention.

After the new SDB structure 68 and isolation structure 70 are formed, asshown in FIG. 6 , a replacement metal gate (RMG) process is conducted totransform the gate structures 24, 26, 28, 30, 32, 34, 36, 38, 40 intometal gates. For instance, the RMG process could be accomplished byfirst performing a selective dry etching or wet etching process usingetchants including but not limited to for example ammonium hydroxide(NH₄OH) or tetramethylammonium hydroxide (TMAH) to remove the gatematerial layer 44 and even gate dielectric layer 42 from each of thegate structures 24, 26, 28, 30, 32, 34, 36, 38, 40 for forming recesses(not shown) in the ILD layer 54.

Next, a selective interfacial layer 76 or gate dielectric layer (notshown), a high-k dielectric layer 78, a work function metal layer 80,and a low resistance metal layer 82 are formed in the recesses, and aplanarizing process such as CMP is conducted to remove part of lowresistance metal layer 82, part of work function metal layer 80, andpart of high-k dielectric layer 78 to form metal gates. In thisembodiment, the gate structures 30, 34, 36 or metal gates fabricatedthrough high-k last process of a gate last process preferably includesan interfacial layer 76 or gate dielectric layer (not shown), a U-shapedhigh-k dielectric layer 78, a U-shaped work function metal layer 80, anda low resistance metal layer 82.

In this embodiment, the high-k dielectric layer 78 is preferablyselected from dielectric materials having dielectric constant (k value)larger than 4. For instance, the high-k dielectric layer 78 may beselected from hafnium oxide (HfO₂), hafnium silicon oxide (HfSiO₄),hafnium silicon oxynitride (HfSiON), aluminum oxide (Al₂O₃), lanthanumoxide (La₂O₃), tantalum oxide (Ta₂O₅), yttrium oxide (Y₂O₃), zirconiumoxide (ZrO₂), strontium titanate oxide (SrTiO₃), zirconium silicon oxide(ZrSiO₄), hafnium zirconium oxide (HfZrO₄), strontium bismuth tantalate(SrBi₂Ta₂O₉, SBT), lead zirconate titanate (PbZr_(x)Ti_(1−x)O₃, PZT),barium strontium titanate (Ba_(x)Sr_(1−x)TiO₃, BST) or a combinationthereof.

In this embodiment, the work function metal layer 80 is formed fortuning the work function of the metal gate in accordance with theconductivity of the device. For an NMOS transistor, the work functionmetal layer 80 having a work function ranging between 3.9 eV and 4.3 eVmay include titanium aluminide (TiAl), zirconium aluminide (ZrAl),tungsten aluminide (WAl), tantalum aluminide (TaAl), hafnium aluminide(HfAl), or titanium aluminum carbide (TiAlC), but it is not limitedthereto. For a PMOS transistor, the work function metal layer 80 havinga work function ranging between 4.8 eV and 5.2 eV may include titaniumnitride (TiN), tantalum nitride (TaN), tantalum carbide (TaC), but it isnot limited thereto. An optional barrier layer (not shown) could beformed between the work function metal layer 80 and the low resistancemetal layer 82, in which the material of the barrier layer may includetitanium (Ti), titanium nitride (TiN), tantalum (Ta) or tantalum nitride(TaN). Furthermore, the material of the low-resistance metal layer 82may include copper (Cu), aluminum (Al), titanium aluminum (TiAl), cobalttungsten phosphide (CoWP) or any combination thereof.

Referring to FIGS. 7-10 , FIGS. 7-10 illustrate a method for fabricatinga semiconductor device along the sectional line AA′ of FIG. 1 accordingto an embodiment of the present invention. As shown in FIG. 7 , it wouldbe desirable to follow the fabrication process as disclosed in FIG. 2 tofirst form a SDB structure 18 in the substrate 12 to divide thefin-shaped structure 14 into two portions 20, 22, gate structures 30, 34on the fin-shaped structure 14, and a gate structure 32 directly on theSDB structure 18. Preferably, each of the gate structures 30, 32, 34 iscomposed of a patterned gate dielectric layer 42, a patterned materiallayer 44, and a hard mask 46, a spacer 48 is formed on the sidewalls ofeach of the gate structures 30, 32, 34, a source/drain region 50 and/orepitaxial layer is formed in the fin-shaped structure 14 adjacent to twosides of the spacer 48, and selective silicide layers (not shown) couldbe formed on the surface of the source/drain regions 50. The compositionof each of the spacers 48 and the source/drain region 50 could be thesame as the ones disclosed in the aforementioned embodiment and thedetails of which are not explained herein for the sake of brevity.

After the source/drain regions 50 are formed, instead of forming an ILDlayer to cover the gate structures 30, 32, 34, a mask layer 84 is formedon and around the gate structures 30, 32, 34 and a patterned mask 86such as patterned resist is formed on the gate structures 30, 32, 34 andthe mask layer 84, in which the patterned mask 86 includes an opening 88exposing the hard mask 46 of the gate structure 32 directly on top ofthe SDB structure 18. In this embodiment, the mask layer 84 ispreferably made of bottom anti-reflective coating (BARC), but notlimited thereto.

Next, as shown in FIG. 8 , an etching process is conducted by using thepatterned resist 86 as mask to remove the hard masks 45 and 46, thepatterned material layer 44, and the patterned gate dielectric layer 42of the gate structure 32 for forming a recess 90 exposing the SDBstructure 18 underneath. After stripping the patterned resist 86,another etching process is conducted without using additional mask toremove the mask layer 84 or BARC completely and exposing the gatestructures 30, 34 on the fin-shaped structure 14.

After removing the mask layer 84, as shown in FIG. 9 , a contact etchstop layer (CESL) 92 is formed in the recess 90 and on the surface ofthe gate structure 30, 34 and the fin-shaped structure 14, and adielectric layer 94 preferably serving as an ILD layer is formed on thegate structures 30, 34 and the CESL 92 to fill the recess 90 completely.Preferably, the CESL 92 is made of dielectric material having stresssuch as but not limited to for example silicon nitride (SiN) or siliconcarbon nitride (SiCN) and the dielectric layer 94 is made of oxides suchas silicon dioxide, but not limited thereto.

Next, as shown in FIG. 10 , a planarizing process such as CMP isconducted to remove part of the dielectric layer 94 and part of the CESL92 to form another SDB structure 96 between the gate structures 30, 34,in which the top surfaces of the SDB structure 96 and the dielectriclayer 94 are coplanar.

Preferably, the new SDB structure 96 includes a bottom portion 98embedded within the fin-shaped structure 14 and a top portion 100 on thebottom portion 98, in which a CESL 92 is disposed between the topportion 100 and the bottom portion 98. Similar to the aforementionedembodiment, the top portion 100 of the SDB structure 96 and the bottomportion 98 of the SDB structure 96 could be selected from the groupconsisting of SiO₂, SiOC, and SiN while the top portion 100 and thebottom portion 98 could be made of same material or different material.

After the new SDB structure 96 is formed, a replacement metal gate (RMG)process is conducted to transform the gate structures 30, 34 into metalgates. For instance, the RMG process could be accomplished by firstperforming a selective dry etching or wet etching process using etchantsincluding but not limited to for example ammonium hydroxide (NH₄OH) ortetramethylammonium hydroxide (TMAH) to remove the gate material layer44 and even gate dielectric layer 42 from each of the gate structures30, 34 for forming recesses (not shown) in the dielectric layer 94.

Next, a selective interfacial layer 76 or gate dielectric layer (notshown), a high-k dielectric layer 78, a work function metal layer 80,and a low resistance metal layer 82 are formed in the recesses, and aplanarizing process such as CMP is conducted to remove part of lowresistance metal layer 82, part of work function metal layer 80, andpart of high-k dielectric layer 78 to form metal gates. Similar to theaforementioned embodiment, each of the gate structures 30, 34 or metalgates fabricated through high-k last process of a gate last processpreferably includes an interfacial layer 76 or gate dielectric layer(not shown), a U-shaped high-k dielectric layer 78, a U-shaped workfunction metal layer 80, and a low resistance metal layer 82.

Referring to FIGS. 1-2 and 11-16 , FIGS. 1-2 and 11-16 illustrate amethod for fabricating semiconductor device according to an embodimentof the present invention, in which FIG. 1 is a top view illustrating amethod for fabricating the semiconductor device, left portions of FIGS.2 and 11-16 illustrate cross-sectional views of FIG. 1 for fabricatingthe semiconductor device along the sectional line AA′, and rightportions of FIGS. 11-16 illustrate cross-sectional views of FIG. 1 forfabricating the semiconductor device along the sectional line BB′. Asshown in FIGS. 11 , after forming the ILD layer 54 as shown in FIG. 2 ,a planarizing process such as CMP could be first conducted to removepart of the ILD layer 54 and then a replacement metal gate (RMG) processis conducted to transform the gate structures 24, 26, 28, 30, 32, 34,36, 38, 40 into metal gates. For instance, the RMG process could beaccomplished by first performing a selective dry etching or wet etchingprocess using etchants including but not limited to for example ammoniumhydroxide (NH4OH) or tetramethylammonium hydroxide (TMAH) to remove thehard masks 46, the gate material layer 44 and even gate dielectric layer42 from each of the gate structures 24, 26, 28, 30, 32, 34, 36, 38, 40for forming recesses (not shown) in the ILD layer 54.

Next, a selective interfacial layer 76 or gate dielectric layer (notshown), a high-k dielectric layer 78, a work function metal layer 80,and a low resistance metal layer 82 are formed in the recesses, and aplanarizing process such as CMP is conducted to remove part of lowresistance metal layer 82, part of work function metal layer 80, andpart of high-k dielectric layer 78 to form metal gates 24, 26, 28, 30,32, 34, 36, 38, 40. In this embodiment, each of the gate structures ormetal gates 24, 26, 28, 30, 32, 34, 36, 38, 40 fabricated through high-klast process of a gate last process preferably includes an interfaciallayer 76 or gate dielectric layer (not shown), a U-shaped high-kdielectric layer 78, a U-shaped work function metal layer 80, and a lowresistance metal layer 82. For simplicity purpose, only the metal gates30, 32, 34, 36, 38 taken along the sectional lines AA′ and BB′ will beaddressed in the following embodiments.

In this embodiment, the high-k dielectric layer 78 is preferablyselected from dielectric materials having dielectric constant (k value)larger than 4. For instance, the high-k dielectric layer 78 may beselected from hafnium oxide (HfO₂), hafnium silicon oxide (HfSiO₄),hafnium silicon oxynitride (HfSiON), aluminum oxide (Al₂O₃), lanthanumoxide (La₂O₃), tantalum oxide (Ta₂O₅), yttrium oxide (Y₂O₃), zirconiumoxide (ZrO₂), strontium titanate oxide (SrTiO₃), zirconium silicon oxide(ZrSiO₄), hafnium zirconium oxide (HfZrO₄), strontium bismuth tantalate(SrBi₂Ta₂O₉, SBT), lead zirconate titanate (PbZr_(x)Ti_(1−x)O₃, PZT),barium strontium titanate (Ba_(x)Sr_(1−x)TiO₃, BST) or a combinationthereof.

In this embodiment, the work function metal layer 80 is formed fortuning the work function of the metal gate in accordance with theconductivity of the device. For an NMOS transistor, the work functionmetal layer 80 having a work function ranging between 3.9 eV and 4.3 eVmay include titanium aluminide (TiAl), zirconium aluminide (ZrAl),tungsten aluminide (WAl), tantalum aluminide (TaAl), hafnium aluminide(HfAl), or titanium aluminum carbide (TiAlC), but it is not limitedthereto. For a PMOS transistor, the work function metal layer 80 havinga work function ranging between 4.8 eV and 5.2 eV may include titaniumnitride (TiN), tantalum nitride (TaN), tantalum carbide (TaC), but it isnot limited thereto. An optional barrier layer (not shown) could beformed between the work function metal layer 80 and the low resistancemetal layer 82, in which the material of the barrier layer may includetitanium (Ti), titanium nitride (TiN), tantalum (Ta) or tantalum nitride(TaN). Furthermore, the material of the low-resistance metal layer 82may include copper (Cu), aluminum (Al), titanium aluminum (TiAl), cobalttungsten phosphide (CoWP) or any combination thereof.

After forming the metal gates, as shown in FIG. 12 , an etching backprocess could be conducted by using the ILD layer 54 as mask to removepart of the metal gates 30, 32, 34, 36, 38 to form recesses 102 in theILD layer 54 and directly on top of the remaining metal gates 30, 32,34, 36, 38.

Next, as shown in FIG. 13 , a patterned mask 104 such as a patternedresist is formed on the metal gates 30, 34, 36 and the ILD layer 54 andfilled into the recesses 102 on top of the metal gates 30, 34, 36, inwhich the patterned mask 104 includes openings 106, 108 exposing theremaining metal gate 32, 38 and even part of the ILD layer 54 adjacentto the metal gates 32, 38.

Next, as shown in FIG. 14 , an etching process is conducted by using thepatterned mask 104 as mask to remove part of the spacers 48 and all ofthe remaining metal gates 32, 38 on top of the SDB structure 18 and STI16. This forms recesses 110, 112 in the ILD layer 54, in which therecess 110 exposes the SDB structure 18 underneath while the recess 112exposes the STI 16 underneath. The patterned mask 104 is removedthereafter. Preferably, the etching process also removes part of thespacers 48 so that the top surface of the remaining spacers 48 whilehaving a planar surface profile is slightly lower than the top surfacesof the ILD layer 54 and the spacers 48 adjacent to the metal gates 30,34, 36 and the bottom surface of the remaining spacers 48 issubstantially even with the bottom surface of the adjacent source/drainregions 50 and/or the top surface of the SDB structure 18.

Next, as shown in FIG. 15 , a cap layer 114 is formed on the ILD layer54 and filled into the recesses 102 atop the metal gates 30, 34, 36 andthe recesses 110, 112 at the same time. It should be noted that sincethe recesses 110, 112 on top of the SDB structure 18 and the STI 16 ismuch deeper than the recesses 102 on top of the metal gates 30, 34, 36,the deposition of the cap layer 114 preferably fills the recesses 102above the metal gates 30, 34, 36 entirely while only fills part of therecesses 110, 112 on top of the SDB structure 18 and STI 16.

Next, a dielectric layer 116 is deposited on the cap layer 114 to fillthe recesses 110, 112 directly above the SDB structure 18 and the STI 16completely. Preferably, the cap layer 114 and the dielectric layer 116are made of different materials, in which the cap layer 114 preferablyincludes silicon nitride (SiN) while the dielectric material 116includes silicon oxide, but not limited thereto.

Next, as shown in FIG. 16 , a planarizing process such as CMP isconducted to remove part of the dielectric layer 116, part of the caplayer 114, and/or even part of the ILD layer 54 so that the top surfacesof the remaining dielectric layer 116 and the cap layer 114 are evenwith the top surface of the ILD layer 54. Preferably, the remaining caplayer 114 and dielectric layer 116 directly on top of the SDB structure18 forms an isolation structure 118 and the remaining cap layer 114 anddielectric layer 116 on top of the STI 16 forms another isolationstructure 120. This completes the fabrication of a semiconductor deviceaccording to an embodiment of the present invention.

Referring again to FIG. 16 , FIG. 16 further illustrates a structuralview of a semiconductor device according to an embodiment of the presentinvention. As shown in FIG. 16 , the semiconductor device includes a SDBstructure 18 dividing fin-shaped structure 14 into a first portion 20and a second portion 22, a STI 16 around the fin-shaped structure 14, anisolation structure 118 disposed on the SDB structure 18, a spacer 48around the isolation structure 118, another isolation structure 120disposed on the STI 16, and another spacer 48 around the isolationstructure 120, in which each of the isolation structures 118, 120includes a T-shape if viewed from a cross-section perspective.

Preferably, each of the isolation structures 118, 120 includes a caplayer 114 on the SDB structure 18 and a dielectric layer 116 on the caplayer 114, in which the cap layer 114 includes a U-shape portion 122 andtwo L-shape portions 124 connected to the U-shape portion 122, sidewallsof the cap layer 114 or L-shaped portions 124 are aligned with sidewallsof the spacers 48, the dielectric layer 116 itself could include aT-shape cross-section, and the cap layer 114 and the dielectric layer116 could constitute a T-shape cross-section altogether. Preferably, thecap layer 114 and the dielectric layer 116 are made of differentdielectric materials, in which the cap layer 114 preferably includessilicon nitride and the dielectric layer 116 preferably includes siliconoxide.

Referring to FIGS. 1-2 and 17-20 , FIGS. 1-2 and 17-20 illustrate amethod for fabricating semiconductor device according to an embodimentof the present invention, in which FIG. 1 is a top view illustrating amethod for fabricating the semiconductor device, left portions of FIGS.2 and 17-20 illustrate cross-sectional views of FIG. 1 for fabricatingthe semiconductor device along the sectional line AA′, and rightportions of FIGS. 17-20 illustrate cross-sectional views of FIG. 1 forfabricating the semiconductor device along the sectional line BB′. Asshown in FIGS. 17 , after forming the ILD layer 54 as shown in FIG. 2 ,a planarizing process such as CMP could be first conducted to removepart of the ILD layer 54 and then a replacement metal gate (RMG) processis conducted to transform the gate structures 24, 26, 28, 30, 32, 34,36, 38, 40 into metal gates. For instance, the RMG process could beaccomplished by first performing a selective dry etching or wet etchingprocess using etchants including but not limited to for example ammoniumhydroxide (NH4OH) or tetramethylammonium hydroxide (TMAH) to remove thehard masks 46, the gate material layer 44 and even gate dielectric layer42 from each of the gate structures 24, 26, 28, 30, 32, 34, 36, 38, 40for forming recesses (not shown) in the ILD layer 54.

Next, a selective interfacial layer 76 or gate dielectric layer (notshown), a high-k dielectric layer 78, a work function metal layer 80,and a low resistance metal layer 82 are formed in the recesses, and aplanarizing process such as CMP is conducted to remove part of lowresistance metal layer 82, part of work function metal layer 80, andpart of high-k dielectric layer 78 to form metal gates 24, 26, 28, 30,32, 34, 36, 38, 40. In this embodiment, each of the gate structures ormetal gates 24, 26, 28, 30, 32, 34, 36, 38, 40 fabricated through high-klast process of a gate last process preferably includes an interfaciallayer 76 or gate dielectric layer (not shown), a U-shaped high-kdielectric layer 78, a U-shaped work function metal layer 80, and a lowresistance metal layer 82. For simplicity purpose, only the metal gates30, 32, 34, 36, 38 taken along the sectional lines AA′ and BB′ will beaddressed in the following embodiments.

In this embodiment, the high-k dielectric layer 78 is preferablyselected from dielectric materials having dielectric constant (k value)larger than 4. For instance, the high-k dielectric layer 78 may beselected from hafnium oxide (HfO₂), hafnium silicon oxide (HfSiO₄),hafnium silicon oxynitride (HfSiON), aluminum oxide (Al₂O₃), lanthanumoxide (La₂O₃), tantalum oxide (Ta₂O₅), yttrium oxide (Y₂O₃), zirconiumoxide (ZrO₂), strontium titanate oxide (SrTiO₃), zirconium silicon oxide(ZrSiO₄), hafnium zirconium oxide (HfZrO₄), strontium bismuth tantalate(SrBi₂Ta₂O₉, SBT), lead zirconate titanate (PbZr_(x)Ti_(1−x)O₃, PZT),barium strontium titanate (Ba_(x)Sr_(1−x)TiO₃, BST) or a combinationthereof.

In this embodiment, the work function metal layer 80 is formed fortuning the work function of the metal gate in accordance with theconductivity of the device. For an NMOS transistor, the work functionmetal layer 80 having a work function ranging between 3.9 eV and 4.3 eVmay include titanium aluminide (TiAl), zirconium aluminide (ZrAl),tungsten aluminide (WAl), tantalum aluminide (TaAl), hafnium aluminide(HfAl), or titanium aluminum carbide (TiAlC), but it is not limitedthereto. For a PMOS transistor, the work function metal layer 80 havinga work function ranging between 4.8 eV and 5.2 eV may include titaniumnitride (TiN), tantalum nitride (TaN), tantalum carbide (TaC), but it isnot limited thereto. An optional barrier layer (not shown) could beformed between the work function metal layer 80 and the low resistancemetal layer 82, in which the material of the barrier layer may includetitanium (Ti), titanium nitride (TiN), tantalum (Ta) or tantalum nitride(TaN). Furthermore, the material of the low-resistance metal layer 82may include copper (Cu), aluminum (Al), titanium aluminum (TiAl), cobalttungsten phosphide (CoWP) or any combination thereof.

Next, part of the metal gates 30, 32, 34, 36, 38 are removed to formrecesses (not shown) in the ILD layer 54, and a cap layer 132 or hardmask is formed atop each of the remaining metal gates 30, 32, 34, 36, 38so that the top surfaces of the cap layer 132 and the ILD layer 54 arecoplanar. In this embodiment, the cap layer 132 is preferably made ofdielectric material including but not limited to for example SiN.

Next, as shown in FIG. 18 , a patterned mask 134 such as a patternedresist is formed on the metal gates 30, 34, 36 and the ILD layer 54, inwhich the patterned mask 134 includes openings (not shown) exposing thecap layers 132 directly on top of the SDB structure 18 and the STI 16.Next, an etching process is conducted by using the patterned mask 134 asmask to remove part of the spacers 48, the cap layers 132 on the metalgates 32, 38, and remaining metal gates 32, 38 on top of the SDBstructure 18 and STI 16. This forms recesses 136, 138 in the ILD layer54, in which the recess 136 exposes the SDB structure 18 underneathwhile the recess 138 exposes the STI 16 underneath and the bottomsurface of the recesses 136, 138 is substantially lower than the bottomsurfaces of the adjacent metal gates 30, 34, 36 disposed on thefin-shaped structure 14. Similar to the aforementioned embodiment, theetching process also removes part of the spacer 48 so that the topsurface of the remaining spacer 48 while having a planar surface profileis slightly lower than the top surfaces of the ILD layer 54 and thespacer 48 adjacent to the metal gates 30, 34, 36, and the bottom surfaceof the remaining spacer 48 is substantially even with the bottom surfaceof the adjacent source/drain regions 50 and/or the top surface of theSDB structure 18.

Next, as shown in FIG. 19 , after stripping the patterned mask 134, adielectric layer 140 is deposited on the metal gates 30, 34, 36, the ILDlayer 54, and into the recesses 136, 138 to fill the recesses 136, 138completely. Preferably, the dielectric layer 140 and the ILD layer 54surrounding the metal gates 30, 34, 36 could be made of same material ordifferent materials, in which both layers could be made of oxidesincluding but not limited to for example silicon dioxide (SiO₂), siliconoxynitride (SiON), or tetraethyl orthosilicate (TEOS).

Next, as shown in FIG. 20 , an optional planarizing process such as CMPprocess could be conducted to remove part of the dielectric layer 140 toform an isolation structure 142 on the SDB structure 18 and anotherisolation structure 144 on the STI 16, in which the top surface of theisolation structures 142, 144 is even with the top surface of the ILDlayer 54. This completes the fabrication of a semiconductor deviceaccording to an embodiment of the present invention.

Referring again to FIG. 20 , FIG. 20 further illustrates a structuralview of a semiconductor device according to an embodiment of the presentinvention. As shown in FIG. 16 , the semiconductor device includes a SDBstructure 18 dividing fin-shaped structure 14 into a first portion 20and a second portion 22, a STI 16 around the fin-shaped structure 14, anisolation structure 142 disposed on the SDB structure 18, a spacer 48around the isolation structure 142, another isolation structure 144disposed on the STI 16, and another spacer 48 around the isolationstructure 142, in which each of the isolation structures 142, 144includes a T-shape if viewed from a cross-section perspective.

Preferably, each of the isolation structures 142, 144 includesdielectric layer 140 on the SDB structure 18 and the STI 16, in whichthe dielectric layer 140 itself could include a T-shape cross-section,and sidewalls of the isolation structures 142, 144 are aligned withsidewalls of the spacers 48. Moreover, the bottom surface of the spacer48 around the isolation structures 142, 144 is lower than the bottomsurface of the spacer 48 around the metal gates 30, 34, 36, the topsurface of the spacer 48 around the isolation structures 142, 144 islower than the top surface of the spacer 48 around the metal gates 30,34, 36 and higher than the bottom surface of the spacer 48 around themetal gates 30, 34, 36. Preferably, the dielectric layer 140 and the ILDlayer 54 could be made of same or different dielectric materials whileboth the dielectric layer 140 and the ILD layer 54 could includedielectric materials including but not limited to for example siliconoxide, silicon oxynitride, TEOS, or combination thereof.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A method for fabricating semiconductor device,comprising: providing a substrate having a fin-shaped structure thereon;forming a single diffusion break (SDB) structure in the substrate todivide the fin-shaped structure into a first portion and a secondportion; forming a first gate structure on the SDB structure; forming aninterlayer dielectric (ILD) layer around the first gate structure;transforming the first gate structure into a first metal gate; removingthe first metal gate to form a first recess; and forming a dielectriclayer in the first recess.
 2. The method of claim 1, further comprising:forming a second gate structure adjacent to the first gate structure onthe fin-shaped structure; forming the ILD layer around the first gatestructure and the second gate structure; transforming the first gatestructure and the second gate structure into the first metal gate and asecond metal gate; removing part of the second metal gate to form asecond recess; removing the first metal gate to form the first recess;forming a cap layer in the first recess and the second recess; formingthe dielectric layer in the first recess; and planarizing the dielectriclayer and the cap layer.
 3. The method of claim 2, wherein a bottomsurface of the first gate structure is lower than a bottom surface ofthe second gate structure.
 4. The method of claim 2, wherein a bottomsurface of the first recess is lower than a bottom surface of the secondrecess.
 5. The method of claim 2, further comprising: forming a firstspacer around the first gate structure; forming the ILD layer around thefirst gate structure; transforming the first gate structure into thefirst metal gate; removing the first metal gate and part of the firstspacer to form the first recess; and forming the cap layer on the firstspacer; and forming the dielectric layer on the cap layer.
 6. The methodof claim 5, wherein a top surface of the first spacer is lower than atop surface of the ILD layer.
 7. The method of claim 1, furthercomprising: forming a second gate structure adjacent to the first gatestructure on the fin-shaped structure; forming the ILD layer around thefirst gate structure and the second gate structure; transforming thefirst gate structure and the second gate structure into the first metalgate and a second metal gate; forming a cap layer on each of the firstmetal gate and the second metal gate; removing the first metal gate toform the first recess; and forming a dielectric layer in the firstrecess.
 8. The method of claim 7, further comprising: forming a firstspacer around the first gate structure; forming the ILD layer around thefirst gate structure; transforming the first gate structure into thefirst metal gate; removing the first metal gate and part of the firstspacer to form the first recess; and forming the dielectric layer on thefirst spacer and in the first recess.
 9. The method of claim 8, whereina top surface of the first spacer is lower than a top surface of the ILDlayer.